Precision Passive Components for Optical Communications
V-Groove Substrates · Fiber Arrays (FA)
Precision passive components for optical communications — V-groove substrates and fiber arrays (FA), with precision grooving, ultra-precision fiber assembly and endface grinding & polishing all done in-house.
Product Categories
Our products are built around two base materials — V-groove substrates and fiber arrays — and serve mainstream applications such as PLC splitters, high-speed optical modules and CPO/FAU. Critical processes run on our own production lines, with traceable process data.
Our Philosophy
We do one thing only: make V-grooves and fiber arrays to a precision standard.
From precision grooving and ultra-precision fiber assembly to endface grinding and polishing, every critical process runs on our own production lines, with traceable process data. Channel pitch 127μm / 250μm, adjacent groove center-to-center accuracy up to ±0.5μm, channel counts from 2 to 192CH. Products meet TC (thermal cycling) and PCT (pressure cooker) reliability test requirements, with good batch-to-batch consistency.
Refinement and craftsmanship — that is how we treat every V-groove substrate and every fiber array.
Six Core Processes — All In-House
From substrate to shipment, every critical process runs in our own cleanroom, with parameterised control and traceable process data.
- 01
Substrate Processing
Quartz or silicon, low-CTE
In-House - 02
Precision V-Groove Dicing
Pitch accuracy ±0.5μm
In-House - 03
Fiber Assembly
Micron-level fiber positioning
In-House - 04
Multi-Point Bonding
Low stress, no fiber shift
In-House - 05
Endface Grinding & Polishing
Angle tolerance ±0.3°
In-House - 06
Inspection & Shipping
Full inspection with records
In-House
Production & Quality Control
Our own cleanroom and automated production lines cover the entire flow of precision grooving, fiber assembly, endface grinding and polishing, and inspection. Process data for critical steps is traceable, and products meet TC and PCT reliability test requirements.
Quality & Inspection Capability
Self-check and dedicated inspection at every critical step. Every passive component is optically and endface tested before shipment.
- Meets TC (thermal cycling) and PCT (pressure cooker) test requirements
- Low-CTE substrate materials keep fibers stable with no device stress at high temperature
- Inspection record shipped with every order
- Test reports and COC available on request
Applications
V-groove substrates and fiber arrays are base passive materials across the optical communications chain, feeding the main applications below.
PLC Splitters
Fiber arrays couple fibers to waveguide chips efficiently, sharply lowering alignment loss in planar lightwave circuits.
AWG & WDM Devices
Multi-channel FA couples AWG chip inputs and outputs; channel consistency and endface quality drive IL and crosstalk.
400G / 800G Optical Modules & Engines
4CH and 8CH FA for optical coupling on the transmit side (laser to fiber) and receive side (fiber to detector).
CPO & Silicon Photonics (FAU)
Fiber array units are essential for interconnecting optical engines with external fiber; V-groove precision sets coupling efficiency.
Active / Passive Array Devices & MEMS
For MEMS, multi-channel optical modules and any application needing high-density, low-loss fiber alignment.
Fiber Sensing & Industrial
Stable distribution and transmission of multi-channel optical signals in fiber sensing and fiber laser systems.