V-Groove Substrate 12CH (Silicon)

Precision V-groove substrate, 12 channels on a silicon substrate, channel pitch 127μm/250μm, adjacent groove pitch accuracy ±0.5μm, groove parallelism better than ±0.1°. Sizes customized to drawing.

Description

The V-Groove Substrate 12CH (Silicon) is the core base component of a fiber array. Using a precision grooving process, we machine 12 V-shaped alignment grooves into a low-expansion silicon substrate or silicon to align and fix bare fibers precisely — the key material for reducing coupling loss in planar lightwave circuit (PLC) splitters, arrayed waveguide gratings (AWG) and similar devices.

Product Features

  • Channel count 12CH on a silicon substrate, channel pitch selectable 127μm or 250μm; higher counts customized to drawing
  • Adjacent groove pitch accuracy up to ±0.5μm; groove parallelism better than ±0.1°
  • Substrate material: silicon
  • Length, width and thickness customized to customer drawing; parallelogram and other profiled structures available
  • The 12-channel structure suits high-density parallel coupling.

Specifications

Channel Count 12 CH
Channel Pitch 127 μm / 250 μm
Adjacent Groove Pitch Accuracy ±0.5 μm
Groove Parallelism (length direction) Better than ±0.1°
Substrate Material Silicon
Substrate Size (L × W × T) Customized to customer drawing
Profiled Structures Parallelogram, special-angle endfaces and similar profiles supported
Endface Process Endface flatness and fiber height controlled; 0° straight and special-angle endfaces supported
Reliability Meets TC (thermal cycling) and PCT (pressure cooker) test requirements

Typical Applications

  • Base substrate and coupling alignment for planar lightwave circuit (PLC) splitters
  • Arrayed waveguide gratings (AWG) and WDM devices
  • Base material for fiber arrays (FA)
  • Fiber positioning and fixing inside optical modules and optical engines

Why Choose FiberPioneer

In-House Production

Precision grooving, ultra-precision fiber assembly and endface grinding & polishing all run on our own cleanroom lines, with parameterised control and traceable process data.

Backed by an Invention Patent

In 2026 we acquired the invention patent “A manufacturing method for precise alignment of multi-core optical fibers”, supporting continuous iteration on multi-core, high-density fiber alignment.

Sampling to Pilot Run

Drawing review, rapid sampling and small-batch pilot production — special angles and profiled structures customized to your drawing.

Invention PatentZL 202411854277.0A manufacturing method for precise alignment of multi-core optical fibers

Need a datasheet, sample or quotation? Submit your requirements via the contact page and we will reply shortly.

Additional information

Channel Count

12 CH

Channel Pitch

127 μm, 250 μm

Substrate Material

Silicon

Groove Pitch Accuracy

±0.5 μm

Groove Parallelism

Better than ±0.1°